Principal Engineer — Advanced Packaging & 3D Integration

Micron Technology, Inc. is seeking an experienced Principal Engineer for the Advanced Package Technology Development team at our Boise campus. You will influence solutions aligned with company goals, contribute to revenue growth, and lead cross-disciplinary teams in developing next-generation packaging technologies. Responsibilities include driving technology roadmaps, collaborating with internal/external partners, and mentoring teams to deliver high-impact innovations in memory packaging. J-18…

Summary and match are AI-generated; verify details on the original posting.

Listed via Adzuna. All sources