Principal CMP Engineer: 3D NAND Process & Innovation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is seeking a Staff/Principal Engineer to lead CMP process development for next-generation 3D NAND. You will work with process integration and other areas (Wet etch, CVD, Diffusion, Metals, Lithography) to own the process roadmap and meet program and yield goals. You will mentor teams, collaborate across global sites, and drive innovations through AI-enabled improvements and patents. A strong background in CMP for 300mm wafers is essential. J-18808-…

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